ON Semiconductor announces Integrated Solutions for Industrial Motor Drives at APEC 2021

By OEM Update Editorial June 15, 2021 6:49 pm IST

Rugged, transfer-moulded modules simplify compact motor drive design.

Semiconductor®, driving energy efficient innovations, announces new, integrated, converter-inverter-power factor correction (PFC) modules for use in industrial motor drives, servo drives and HVAC, where they are used to drive motors for applications including fans and pumps.

The new NXH50M65L4C2SG and NXH50M65L4C2ESG are transfer−moulded power integrated modules (TMPIM) based upon standard aluminium oxide (AI2O3) substrate and enhanced low thermal resistance substrate respectively. Ideally suited to rugged industrial applications with high output power, the modules contain a converter−inverter−PFC circuit consisting of single-phase converter with four 75 A, 1600 V rectifiers. The 3-phase inverter uses six 50 A, 600 V IGBTs with inverse diodes and the dual−channel interleaved PFC comprises two 75 A, 650 V PFC IGBTs with inverse diodes and two 50 A, 650 V PFC diodes. An NTC thermistor is embedded to allow for monitoring of device temperature during operation.

As the module is pre-assembled in an optimised layout and configuration, parasitic elements are very small when compared with discrete PCB-based designs, thereby allowing a wide PFC switching frequency range between 18 kHz and 65 kHz. The highly efficient NXH50M65L4C2SG and NXH50M65L4C2ESG are rated at 50 A permitting use in applications up to 8 kW, and are the latest devices in the ON Semiconductor TMPIM family. Other devices are available with current ratings of 20 A and 30 A.

The new NXH50M65L4C2SG and NXH50M65L4C2ESG work alongside the FAN9672 PFC controller and gate driver solutions including devices in the new NCD5700x family. The recently introduced NCD57252 dual channel isolated IGBT/MOSFET gate driver offers 5 kV of galvanic isolation and can be configured for dual low-side, dual high-side or half-bridge operation. The NCD57252 is housed in a small SOIC-16 wide body package and accepts logic level inputs (3.3 V, 5 V & 15 V). The high current device (source 4.0 A / sink 6.0 A at Miller plateau voltage) is suitable for high-speed operation as typical propagation delays are 60 ns.

For more info, visit: https://www.onsemi.com/