Texas Instruments unveils solderless robotics kit

By OEM Update Editorial August 7, 2019 3:11 pm IST

Texas Instruments (TI) has introduced the newest addition to the TI Robotics System Learning Kit (TI-RSLK) family, the TI-RSLK MAX, a low-cost robotics kit and curriculum that is simple to build, code and test. Designed for the university classroom, the solderless assembly allows students to have their own fully functioning embedded system built in under 15 minutes. Classrooms that may not have access to soldering equipment benefit from the solderless, hands-on kit and curriculum that can be reused year after year.

The launch in India saw IEEE President and CEO, Professor Jose Moura, unveil the product along with Doug Phillips, Director of TI’s Global University Program. The new kit includes the industry-leading SimpleLink MSP432P401R microcontroller (MCU) LaunchPad Development Kit, easy-to-connect sensors, and a versatile chassis board that turns the robot into a mobile learning platform. Through accompanying core and supplemental curriculum, students learn how to integrate their hardware and software knowledge to build and test a system. For advanced learning, wireless communication and Internet of Things (IoT) capabilities can be added to the TI-RSLK MAX to remotely control the robot or even establish robot-to robot communication.

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