Bostik showcases innovative and customised cutting edge technology solutions at PackPlus India 2019

By admin September 3, 2019 1:05 pm

[vc_row][vc_column][vc_column_text]Bostik, one of the leading global adhesive specialist for industrial, construction and consumer markets, is exhibiting at PackPlus
India 2019, showcasing its products and technology for the packaging industry. Having been held for close to a decade, PackPlus is India’s biggest exhibition on packaging, converting and supply chain industries.

According to a recent report by research from PC Wood Mackenzie, demand for flexible packaging in the Indian market is estimated to grow at nearly 10 per cent a year over the next five years, currently estimated at USD 5.6 billion in 2017.

Daniel Thong, Regional Market Manager for Flexible Packaging, said: ‘With the growing urbanisation and rising population of middle class consumers in India, the packaging industry is experiencing exponential growth. There is no better time than now to increase our presence in the industry, and that is why we are very excited to be back at PackPlus, to showcase our range of laminating applications with solvent and solvent-free products that can be used across the flexible packaging industry.’

With over 100 years of experience in the adhesives industry and having been present in Asia for more than 30 years, Bostik understands the challenges faced by customers and develops innovative adhesives solutions that are smarter and more adaptable. As a pioneer in flexible packaging technologies, Bostik’s customised solutions with cutting edge packaging technology meets the most demanding packaging applications.

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PackPlus India is happening from today (28 August) until 31 August 2019, at Pragati Maidan, New Delhi, India. Bostik’s booth is located at Exhibition Hall 11-213.

For further information, please visit the website https://www.bostik.com/.[/vc_column_text][/vc_column][/vc_row]